This conference is sponsored by the SIAM Activity Group on Geometric Design and in cooperation with ACM SIGGRAPH.

The SIAM Conference on Mathematics for Industry: Challenges and Frontiers will follow this meeting at the same location from October 9-10, 2009.

Use the navigational buttons on the right side of this page for additional information.

Announcements

Students are encouraged to apply for travel support. Applications deadline for these awards is August 10, 2009.

As of January 12, 2009, a valid ESTA approval is required for all Visa Waiver Program (VWP) to travel to the United States. Please visit http://travel.state.gov/visa/temp/without/without_1990.html for additional information and procedures.


2009 SIAM/ACM Joint Conference on Geometric and Physical Modeling

Incorporating the 2009 SIAM Conference on Geometric Design and the 2009 ACM Symposium on Solid and Physical Modeling

Plenary Speakers

David Baraff, Pixar Animation Studios
Ted D. Blacker, Sandia National Laboratories
Leonidas Guibas, Stanford University
Baining Guo, Microsoft Research Asia
Stefanie Hahmann, Grenoble Institute of Technology, France
Bert Jüttler, Johannes Kepler University, Austria

Conference History

The previous SIAM GD conferences in this series were held in Tempe, Arizona (1989, 1991, 1993), Nashville, Tennessee (1995, 1997), Albuquerque, New Mexico (1999), Sacramento, California (2001), Seattle, Washington (2003), Phoenix, Arizona (2005), and San Antonio, Texas (2007). Precursors to these meetings were two conferences in Albany, New York (1985, 1987).

The previous ACM Solid Modeling Symposia included events in Austin, Texas (1991), Montreal, Canada (1993), Salt Lake City, Utah (1995), Atlanta, Georgia (1997), Ann Arbor, Michigan (1999, 2001), Saarbrücken, Germany (2002), Seattle, Washington (2003), Genoa, Italy (2004), Cambridge, Massachusetts (2005), Cardiff, Wales, United Kingdom (2006), Beijing, China (2007) and Stony Brook New York (2008).

The common pre-cursors to these conferences were the workshops held in 1986, 1988 in Rensselaerville, New York and sponsored by the IFIP Working Group 5.2. 

Description

The SIAM Special Interest Activity Group on Geometric Design and the ACM Symposium on Solid and Physical Modeling have a shared heritage dating back to the early 1980s.  This joint conference in 2009 represents a historic union of these communities, their rich academic and industrial histories, as well as the common intellectual themes that continue to move them forward.

Over the past twenty years the meetings of the SIAM Special Interest Activity Group on Geometric Design have been one of the main general international conferences on geometric modeling and related areas, and have been well attended by mathematicians and engineers from academia, industry, and government.   Since its inception in 1991, the ACM Symposium on Solid & Physical Modeling has been the primary international forum for disseminating research results and exchanging new ideas in relevant mathematical theory, solid modeling, physical modeling, geometric design, analysis, simulation and processing, shape computing and visualization, and various applications.

The 2009 SIAM/ACM Joint Conference on Geometric and Physical Modeling seeks high quality, original research contributions that strive to advance all aspects of geometric and physical modeling, and their application in design, analysis and manufacturing, as well as in biomedical, geophysical, digital entertainment, and other areas (see the list of conference topics below). A shared objective of both the SIAM GD and ACM SPM communities is a desire to highlight work of the highest quality on the problems of greatest relevance to industry and science.

Funding Agency

nsf
SIAM and the Conference Organizing Committee wish to extend their thanks and appreciation to the U.S. National Science Foundation for its support of this conference.


Themes

Submissions are welcomed on any related topics or applications, including, but not limited to the following:

Topics

Applications

Important Deadlines

SUBMISSION DEADLINES
Contributions are solicited in any of three different tracks: peer-reviewed technical papers for proceedings, minisymposia, and contributed talks/posters. See submissions for additional information. The deadlines for submission are:

Abstract submissions for proceedings: March 1, 2009
Full paper submissions for proceedings: March 16, 2009
Minisymposia: May 15, 2009
Contributed talks/posters: May 15, 2009

PRE-REGISTRATION DEADLINE
September 8, 2009

HOTEL RESERVATION DEADLINE
September 7, 2009 Extended to September 14, 2009

Organizing Committee

General Chairs
Daniel Gonsor, The Boeing Company
William Regli, Drexel University

General Co-Chairs
Thomas Grandine, The Boeing Company
Jan Vandenbrande, The Boeing Company

Honorary Chairs
George Allen, Siemens PLM Software
Michael Wozny, Rensselaer Polytechnic Institute

Program Chairs
Wim Bronsvoort, Delft University of Technology, The Netherlands
Jens Gravesen, Technical University of Denmark, Denmark
John Keyser, Texas A&M University

Program Committee
Pierre Alliez, INRIA - Geometrica, France
Cecil Armstrong, Queen's University Belfast, United Kingdom
Chandrajit Bajaj, University of Texas
Alexander Belyaev, Heriot-Watt University, United Kingdom
George-Pierre Bonneau, GRAVIR-IMAG, France
Fuhua (Frank) Cheng, University of Kentucky
Shuo-Yan Chou, National Taiwan University of Science and Technology, Taiwan
Jonathan Corney, University of Strathclyde, United Kingdom
Leila De Floriani, University of Genova, Italy
Tamal K. Dey, The Ohio State University
Tor Dokken, SINTEF, Norway
Deba Dutta, University of Illinois at Urbana-Champaign
Herbert Edelsbrunner, Duke University
Gershon Elber, Technion, Israel
Ioannis Z. Emiris, University of Athens, Greece
Gerald Farin, Arizona State University
Anath Fischer, Technion, Israel
Michael Floater, University of Oslo, Norway
Shuming Gao, Zhejiang University, China
Laureano Gonzalez-Vega, Universidad de Cantabria, Spain
Xianfeng David Gu, Stony Brook University
Satyandra Gupta, University of Maryland
Balan Gurumoorthy, Indian Institute of Science, India
Hans Hagen, University of Kaiserslautern, Germany
Stefanie Hahmann, Laboratoire LJK-IMAG, France
Kirk Haller, SolidWorks
Dan Halperin, Tel Aviv University, Israel
Dianne Hansford, Arizona State University
Christoph M. Hoffmann, Purdue University
Kai Hormann, Clausthal University of Technology, Germany
Shi-Min Hu, Tsinghua University, China
Horea T. Ilies, University of Connecticut
Ravi Janardan, University of Minnesota
Robert Joan-Arinyo, Universitat Politecnica de Catalunya, Spain
Tao Ju, Washington University at St. Louis
Bert Jüttler, Johannes Kepler Universität Linz, Austria
David Kasik, Boeing
Deok-Soo Kim, Hanyang University, South Korea
Young Kim, Ewha University, South Korea
Leif Kobbelt, RWTH Aachen, Germany
Shankar Krishnan, AT&T Labs
Ming-Jun Lai, University of Georgia
Michael Lachance, University of Michigan
Jean-Claude Latombe, Stanford University
Kunwoo Lee, Seoul National University, South Korea
Bruno Lévy, INRIA, France
Jyh-Ming Lien, George Mason University
André Lieutier, Dassault Systems, France
Takashi Maekawa, Yokohama National University, Japan
Stephen Mann, University of Waterloo, Canada
Dinesh Manocha, University of North Carolina
Ralph Martin, Cardiff University, United Kingdom
Sara McMains, University of California, Berkeley
Gopi Meenakshisundaram, University of California, Irvine
Niloy Mitra, Indian Institute of Technology, India
Bernard Mourrain, INRIA - Sophia Antipolis, France
Ahmad Nasri, American University of Beirut, Lebanon
Marian (Mike) Neamtu, Vanderbilt University
Yutaka Ohtake, RIKEN, Japan
Alberto Paoluzzi, Università di Roma Tre, Italy
Jorg Peters, University of Florida
Konrad Polthier, Freie Universität Berlin, Germany
Helmut Pottmann, Vienna University of Technology, Austria
Hartmut Prautzsch, Karlsruhe University, Germany
Hong Qin, Stony Brook University
Ewald Quak, Tallinn University of Technology, Estonia
Karthik Ramani, Purdue University
Ari Rappoport, The Hebrew University of Jerusalem, Israel
Stephane Redon, INRIA, France
Ulrich Reif, Darmstadt University of Technology, Germany
Jarek Rossignac, Georgia Institute of Technology
Nick Sapidis, University of the Aegean, Greece
Scott Schaefer, Texas A&M University
Hans-Peter Seidel, MPI Informatik, Saarbrücken, Germany
Vadim Shapiro, University of Wisconsin-Madison
Alla Sheffer, University of British Columbia, Canada
Kenji Shimada, Carnegie Melon University
Hayong Shin, KAIST, South Korea
Claudio T. Silva, University of Utah
Olga Sorkine, New York University
Michela Spagnuolo, IMATI, Italy
Kokichi Sugihara, University of Tokyo, Japan
Krishnan Suresh, University of Wisconsin-Madison
Hiromasa Suzuki, University of Tokyo, Japan
Ruofeng Tong, Zhejiang University, China
George Turkiyyah, University of Washington
Tamás Várady, Geomagic, Hungary
Amitabh Varshney, University of Maryland
Gert Vegter, University of Groningen, The Netherlands
Luiz Velho, IMPA, Brazil
Don Vossler, Unigraphics
Charlie Wang, Chinese University of Hong Kong, Hong Kong
Wenping Wang, The University of Hong Kong, Hong Kong
Joe Warren, Rice University
Richard (Hao) Zhang, Simon Fraser University, Canada
Denis Zorin, New York University

Use the navigational buttons on the upper right side of this page for additional information.

Renew SIAM · Contact Us · Site Map · Join SIAM · My Account
Facebook Twitter Youtube