This conference is sponsored by the SIAM Activity Group on Geometric Design and in cooperation with ACM SIGGRAPH, incorporating the 2011 SIAM Conference on Geometric Design and the 2011 Symposium on Solid and Physical Modeling.

Visit http://siam.orlandomeetinginfo.com/ for local area information and special discounts available to SIAM attendees.

Announcements

To RSVP to the conference on Facebook and connect with other attendees, find roommates etc., please go to the link below:
http://www.facebook.com/event.php?eid=205034719518515#!/SIAMconnect.

If you are tweeting about the conference, please use the designated hashtag to enable other attendees to keep up with the Twitter conversation and to allow better archiving of our conference discussions.  The hashtag for this meeting is #GDSPM11.

Important Deadlines

See submissions for additional information. The deadlines for submission are:

Abstract submissions for proceedings: April 18, 2011
Full paper submissions for proceedings: April 25, 2011
Minisymposia: May 30, 2011
Contributed talks and posters:  May 30, 2011

TRAVEL FUND APPLICATION DEADLINE
June 20, 2011: SIAM Student Travel Award and Post-doc/Early Career Travel Award Applications

PRE-REGISTRATION DEADLINE
September 26, 2011: Disconnect time is 4:00 PM EDT

HOTEL RESERVATION DEADLINE
September 26, 2011

Themes and Topics

Applications

Description

The SIAM Special Interest Activity Group on Geometric Design and the ACM Symposium on Solid and Physical Modeling have a shared heritage dating back to the early 1980s. This biennial joint conference (started in 2009) represents a historic union of these communities, their rich academic and industrial histories, as well as the common intellectual themes that continue to move them forward. Over the past twenty years the meetings of the SIAM Special Interest Activity Group on Geometric Design have been one of the main general international conferences on geometric modeling and related areas, and have been well attended by mathematicians and engineers from academia, industry, and government. Since its inception in 1991, the ACM Symposium on Solid and Physical Modeling has been the primary international forum for disseminating research results and exchanging new ideas in relevant mathematical theory, solid modeling, physical modeling, geometric design, analysis, simulation and processing, shape computing and visualization, and various applications.

The 2011 SIAM Conference on Geometric and Physical Modeling seeks high quality, original research contributions that strive to advance all aspects of geometric and physical modeling, and their application in design, analysis and manufacturing, as well as in biomedical, geophysical, digital entertainment, and other areas (see the list of conference topics below). A shared objective of both the SIAM GD and ACM SPM communities is a desire to highlight work of the highest quality on the problems of greatest relevance to industry and science.

In ACM SPM tradition, the conference will include a track for submission of peer-reviewed technical papers for those wishing rigorous peer review and published proceedings. In addition, in the tradition of previous SIAM GD events, abstracts for minisymposia and contributed talks/posters are solicited.

Organizing Committee

General Co-chairs:
Nick Patrikalakis, Massachusetts Institute of Technology, USA
Jörg Peters, University of Florida, USA
Jarek Rossignac, Georgia Institute of Technology, USA
Timothy L. Strotman, Siemens PLM Software, USA

Program Co-chairs:
Chandrajit Bajaj, University of Texas, USA
Stefanie Hahmann, University Grenoble INP, France
Myung-Soo Kim, Seoul National University, Korea

Program Committee

Nina Amenta, University of California at Davis, USA
Cecil Armstrong, Queen's University Belfast, United Kingdom
Alexander Belyaev, Heriot-Watt University, United Kingdom
Michel Bercovier, The Hebrew University of Jerusalem, Israel
Luc Biard, University of Grenoble, France
George Biros, Georgia Institute of Technology, USA
Jean-Daniel Boissonnat, INRIA Sophia-Antipolis, France
George-Pierre Bonneau, GRAVIR-IMAG, France
Mario Botsch, Bielefeld University, Germany
Wim Bronsvoort, Delft University of Technology, Netherlands
Guido Brunnett, Technische Universität Chemnitz, Germany
Frédéric Cazals, INRIA Sophia-Antipolis, France
Falai Chen, University of Science and Technology, China
Fuhua (Frank) Cheng, University of Kentucky, USA
Elaine Cohen, University of Utah, USA
Jonathan Corney, University of Strathclyde, United Kingdom
Leila De Floriani, University of Genova, Italy
Tamal Dey, Ohio State University, USA
Tor Dokken, SINTEF, Norway
Gershon Elber, Technion, Israel
Ioannis Emiris, University of Athens, Greece
Anath Fischer, Technion, Israel
Shuming Gao, Zhejiang University, China
Ron Goldman, Rice University, USA
Thomas Grandine, The Boeing Company, USA
Jens Gravesen, Technical University of Denmark, Denmark
Markus Gross, ETH Zurich, Switzerland
David Gu, Stony Brook University, USA
Xiaohu Guo, University of Texas at Dallas, USA
Balan Gurumoorthy, Indian Institute of Science, India
Hans Hagen, University of Kaiserslautern, Germany
Dan Halperin, Tel Aviv University, Israel
Dianne Hansford, Arizona State University, USA
Ying He, Nanyang Technological University, Singapore
Chris Hoffmann, Purdue University, USA
Kai Hormann, Clausthal University of Technology, Germany
Shi-Min Hu, Tsinghua University, China
Thomas Hughes, University of Texas at Austin, USA
Insung Ihm, Sogang University, Korea
Horea Ilies, University of Connecticut, USA
Ravi Janardan, University of Minnesota, USA
Robert Joan-Arinyo, Universitat Politecnica de Catalunya, Spain
Leo Joskowicz, The Hebrew University of Jerusalem, Israel
Kenneth Joy, University of California at Davis, USA
Tao Ju, Washington University at St. Louis, USA
Bert Jüttler, Johannes Kepler Universität Linz, Austria
David Kasik, The Boeing Company, USA
Misha Kazhdan, Johns Hopkins University, USA
Tae-wan Kim, Seoul National University, Korea
Young J. Kim, Ewha University, South Korea
Leif Kobbelt, RWTH Aachen, Germany
Seungyong Lee, POSTECH, Korea
Bruno Lévy, INRIA, France
Jyh-Ming Lien, George Mason University, USA
André Lieutier, Dassault Systems, France
Ligang Liu, Zhejiang University, China
Tom Lyche, University of Oslo, Norway
Takashi Maekawa, Yokohama National University, Japan
Stephen Mann, University of Waterloo, Canada
Dinesh Manocha, University of North Carolina, USA
Ralph Martin, Cardiff University, United Kingdom
Sara McMains, University of California, Berkeley, USA
Gopi Meenakshisundaram, University of California, Irvine, USA
Niloy Mitra, Indian Institute of Technology, India
Geraldine Morin, University of Toulouse, France
Bernard Mourrain, INRIA - Sophia Antipolis, France
Ahmad Nasri, American University of Beirut, Lebanon
Marc Neveu, Université de Bourgogne, France
Yutaka Ohtake, Riken, Japan
Valerio Pascucci, University of Utah, USA
Mark Pauly, EPFL Lausanne, Switzerland
Martin Peternell, Technical University of Vienna, Austria
Konrad Polthier, Freie Universität Berlin, Germany
Hartmut Prautzsch, Karlsruhe University, Germany
Alyn Rockwood, KAUST, Saudi Arabia
Hong Qin, Stony Brook University, USA
Ewald Quak, Tallinn University of Technology, Estonia
Ari Rappoport, Hebrew University of Jerusalem, Israel
Stephane Redon, INRIA, France
Nickolas Sapidis, University of The Aegean, Greece
Scott Schaefer, Texas A&M University, USA
Hans-Peter Seidel, MPI Saarbrücken, Germany
Vadim Shapiro, University of Wisconsin, USA
Alla Sheffer, University of British Columbia, Canada
Kenji Shimada, Carnegie Melon University, USA
Hayong Shin, KAIST, South Korea
Claudio Silva, University of Utah, USA
Olga Sorkine, New York University, USA
Kokichi Sugihara, Meiji University, Japan
Krishnan Suresh, University of Wisconsin-Madison, USA
Hiromasa Suzuki, University of Tokyo, Japan
Ruofeng Tong, Zhejiang University, China
Marc van Kreveld, Utrecht University, The Netherlands
Tamás Várady, Geomagic, Hungary
Amitabh Varshney, University of Maryland, USA
Gert Vegter, University of Groningen, The Netherlands
Luiz Velho, IMPA, Brazil
Johannes Wallner, Graz University of Technology, Austria
Charlie Wang, Chinese University of Hong Kong
Wenping Wang, Hong Kong University, Hong Kong
Joe Warren, Rice University, USA
Guoliang Xu, Chinese Academy of Sciences, China
Weiwei Xu, Microsoft Research Asia, China
Chee Yap, New York University, USA
Hao (Richard) Zhang, Simon Fraser University, Canada

Funding Agency

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SIAM and the Conference Organizing Committee wish to extend their thanks and appreciation to the U.S. National Science Foundation for its support of this conference.

 

 

Important Deadlines

SUBMISSION DEADLINES
Contributions are solicited in any of three different tracks:

  1. peer-reviewed technical papers for proceedings
  2. minisymposia
  3. contributed talks and posters

See submissions for additional information. The deadlines for submission are:

Abstract submissions for proceedings: April 18, 2011
Full paper submissions for proceedings: April 25, 2011
Minisymposia: May 30, 2011  Extended to June 10, 2011
Contributed talks and posters: May 30, 2011  Extended to June 10, 2011

TRAVEL FUND APPLICATION DEADLINE
June 20, 2011: SIAM Student Travel Award and Post-doc/Early Career Travel Award Applications

PRE-REGISTRATION DEADLINE
September 26, 2011: Disconnect time is 4:00 PM EDT

HOTEL RESERVATION DEADLINE
September 26, 2011

 

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