SIAM Conference on Geometric and Physical Modeling (GD/SPM21)

About the Conference

This is the meeting of the SIAM Activity Group on Geometric Design, and in cooperation with ACM SIGGRAPH, incorporating the 2021 SIAM Conference on Computational Geometric Design and the 2021 Symposium on Solid and Physical Modeling.

The SIAM Special Interest Activity Group on Geometric Design (GD) and the Symposium on Solid and Physical Modeling (SPM) have a shared heritage dating back to the early 1980s. This joint conference (started in 2009) represents a historic union of these communities, their rich academic and industrial histories, as well as the common intellectual themes that continue to move them forward.

The 2021 SIAM Conference on Geometric and Physical Modeling seeks high quality, original research contributions that strive to advance all aspects of geometric and physical modeling, and their application in design, analysis, and manufacturing, as well as in biomedical, geophysical, digital entertainment, and other areas (see the list of conference themes).

Both GD and SPM will include a track for submission of technical papers. All papers will be rigorously peer-reviewed by members of the respective international program committees and will be published as a journal special issue: in Computer Aided Geometric Design (Elsevier) in the case of GD, and in Computer-Aided Design (Elsevier) in the case of SPM.

The joint conference will feature a poster session. To facilitate participation, limited travel awards for students and early career academics are available.

Organizing Committee Co-Chairs

Rida Farouki, University of California, Davis, U.S.
Xin Li, Louisiana State University, U.S.
Géraldine Morin, University of Toulouse, France
Jorg Peters, University of Florida, U.S.

Program Committee

Michael Barton, Basque Center for Applied Mathematics, Spain
Georges-Pierre Bonneau, University of Grenoble, France
Carlotta Giannelli, University of Florence, Italy
Jiri Kosinka, University of Groningen, Netherlands
Saigopal Nelaturi, Palo Alto Research Center, U.S.
Daniele Panozzo, Courant Institute of Mathematical Sciences, New York University, U.S.

Solid and Physical Modeling International Program Committee

Ergun Akleman, Texas A&M, U.S.
Nina Amenta, University of California, Davis, U.S.
Chandrajit Bajaj, University of Texas at Austin, U.S.
Morad Behandish, Xerox PARC, U.S.
Silvia Biasotti, CNR Genova, Italy
Pengbo Bo, Harbin Institute of Technology, China
Dobrina Boltcheva, Inria Nancy, France
David Bommes, RWTH Aachen, Germany
Wim Bronsvoort, Delft University of Technology, Netherlands
Laurent Busé, Inria Sophia Antipolis, France
Marcel Campen, Osnabrück University, Germany
Juan Cao, Xiamen University, China
Frédéric Cazals, Inria Sophia Antipolis, France
Raphaelle Chaine, University of Lyon, France
Zhonggui Chen, Xiamen University, China
Elaine Cohen, University of Utah, U.S.
Frédéric Cordier, Université de Haute Alsace, France
Bailin Deng, Cardiff University, United Kingdom
Mathieu Desbrun, Caltech, U.S.
Tamal Dey, Ohio State University, U.S.
Tor Dokken, SINTEF, Norway
Gershon Elber, Technion, Israel
Carlotta Giannelli, University of Florence, Italy
David Xianfeng Gu, Stony Brook University, U.S.
Xiaohu Guo, University of Texas at Dallas, U.S.
Stefanie Hahmann, Grenoble, Europe
John Hart, University of Illinois at Urbana-Champaign, U.S.
Ying He, Nanyang Technological University, Singapore
Christoph Hoffmann, Purdue University, U.S.
Kai Hormann, Università della Svizzera italiana, Switzerland
Qixing Huang, The University of Texas at Austin, U.S.
Horea Ilies, University of Connecticut, U.S.
Ravi Janardan, University of Minnesota, U.S.
Tao Ju, Washington University at St. Louis, U.S.
Bert Jüttler, Johannes Kepler Universität, Austria
John Keyser, Texas A&M University, U.S.
Myung-Soo Kim, Seoul National University, Korea
Leif Kobbelt, RWTH Aachen, Germany
Jiri Kosinka, University of Groningen, The Netherlands
Adarsh Krishnamurthy, Iowa State University, U.S.
Tsz Ho Kwok, Concordia University, Canada
Yu-Kun Lai, Cardiff University, United Kingdom
Miroslav Lavicka, ZU Pilsen, Czech Republic
Jyh-Ming Lien, George Mason University, U.S.
Ligang Liu, University of Science and Technology of China, China
Takashi Maekawa, Waseda University, Japan
Stephen Mann, University of Waterloo, U.S.
Angelos Mantzaflaris, INRIA Sophia-Antipolis, France
Sara McMains, UC Berkeley, U.S.
Bernard Mourrain, Inria, France
Przemyslav Musialski
Daniele Panozzo, NYU, U.S.
Giuseppe Patane, CNR-IMATI, Italy
Jorg Peters, University of Florida, U.S.
Hong Qin, Stony Brook University, U.S.
Lucia Romani, University of Bologna, Italy
Jarek Rossignac, Georgia Institute of Technology, U.S.
Nickolas Sapidis, University of Western Macedonia, Greece
Scott Schaefer, Texas A&M, U.S.Hyewon Seo
Vadim Shapiro, University of Wisconsin, U.S.
Dmitry Sokolov, Université de Lorraine, France
Shinjiro Sueda, Texas A&M, U.S.
Kai Tang, Hong Kong University of Science and Technology, Hong-Kong
Jean-Marc Thiery, Telecom ParisTech, France
Yiying Tong, MSU, U.S.
Charlie Wang, TU Delft, The Netherlands
Jun Wang, Nanjing University of Aeronautics and Astronautics, China
Wenping Wang, Hong Kong University, Hong-Kong
Jun Wu, TU Delft, The Netherlands
Shiqing Xin, Shandong University, China
Yong-Liang Yang, University of Bath, United Kingdom
Jessica Zhang, Carnegie Mellon University, U.S.
Juyong Zhang, University of Science and Technology of China, China
Xiaoting Zhang, Boston University, U.S.
Yunbo Zhang, Rochester Institute of Technology, U.S.
Jianmin Zheng, Nanyang Technological University, Singapore

Geometric Design International Program Committee

Marco Attene, CNR-IMATI, Italy
Pieter Barendrecht, University of
Groningen, Netherlands
Michael Barton, BCAM, Spain
Carolina Beccari, University of Bologna, Italy
Dominique Bechmann, Université de Strasbourg, France
Georges-Pierre Bonneau, University of Grenoble and INRIA, France
Elaine Cohen, University of Utah, U.S.
Frederic Cordier, Universite de Haute Alsace, France
Jiansong Deng, University of Science and Technology of China, China
Chongyang Deng, Hangzhou Dianzi University, China
Olga Diamanti, Graz University of Technology, Austria
Tor Dokken, SINTEF, Norway
Gershon Elber, Technion- Israel Institute of Technology, Israel
Shuming Gao, Zhejiang University, China
Xifeng Gao, Florida State University, U.S.
Daniel Gonsor, The Boeing Company, U.S.
Xiaohu Guo, The University of Texas at Dallas, U.S.
Stefanie Hahmann, University of Grenoble, France
Ying He, Nanyang Technological University, Singapore
Philipp Herholz, ETH Zurich, Switzerland
Martin Hering-Bertram, Hochschule Bremen University of Applied Sciences, Germany
Kai Hormann, University of Lugano, Switzerland
Shi-Min Hu, Tsinghua University, China
Zhangjin Huang, University of Science and Technology of China, China
Horea Ilies, University of Connecticut, U.S.
Ravi Janardan, University of Minnesota, U.S.
Zhongshi Jiang, New York University, U.S.
Tao Ju, Washington University in St. Louis, U.S.
Bert Juettler, Johannes Kepler University, Austria
Mario Kapl, Carinthia University of Applied Sciences, Austria
John Keyser, Texas A&M University, U.S.
Myung-Soo Kim, Seoul National University, South Korea
Deok-Soo Kim, Hanyang University, South Korea
Adarsh Krishnamurthy, Iowa State University, U.S.
Yu-Kun Lai, Cardiff University, United Kingdom
Miroslav Lavicka, The University of West Bohemia, Czech Republic
Xin Li, Louisiana State University, U.S.
Jyh-Ming Lien, George Mason University, U.S.
Hongwei Lin, Zhejiang University, China
Ligang Liu, University of Science and Technology of China , China
Weiyin Ma, City University of Hong Kong, Hong Kong
Stephen Mann, University of Waterloo, Canada
Angelos Mantzaflaris, Inria Sophia Antipolis Méditerranée and Université Côte d'Azur, France
Saigopal Nelaturi, Palo Alto Research Center, Inc., U.S.
Jorg E. Peters, University of Florida, U.S.
Thomas Peters, University of Connecticut, U.S.
Konrad Polthier, Freie Universität Berlin, Germany
Roi Poranne, University of Haifa, Israel
Lucia Romani, University of Bologna, Italy
Maria Lucia Sampoli, University of Siena, Italy
Nickolas S. Sapidis, University of Western Macedonia, Greece
Scott Schaefer, Texas A&M University, U.S.
Teseo Schneider, Courant Institute of Mathematical Sciences, New York University, U.S.
Alessandra Sestini, University of Florence, Italy
Vadim Shapiro, University of Wisconsin-Madison, U.S.
Tim Strotman, Siemens PLM, U.S.
Thomas Takacs, Johannes Kepler University Linz, Austria
Kai Tang, The Hong Kong University of Science and Technology, Hong Kong
Yiying Tong, Michigan State University, U.S.
Georg Umlauf, Hochschule Konstanz, Germany
Charlie Wang, Delft University of Technology, Netherlands
Jun Wang, Nanjing University of Aeronautics and Astronautics, China
Chee Yap, New York University, U.S.
Thomas Yu, Drexel University, U.S.
Jianmin Zheng, Nanyang Technological University, Singapore

Funding Agency

SIAM and the Organizing Committee wish to extend their thanks and appreciation to the U.S. National Science Foundation for its support of this conference.

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