This conference is sponsored by the SIAM Activity Group on Geometric Design and in cooperation with ACM SIGGRAPH, incorporating the 2013 SIAM Conference on Geometric Design and the 2013 Symposium on Solid and Physical Modeling



Math of Planet Earth 2013

2013 is designated as the year of Math of Planet Earth. SIAM supports MPE2013.

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Organizing Committee

General Co-chairs
Elaine Cohen, University of Utah, USA
Stefanie Hahmann, University Grenoble INP, France
Konrad Polthier, Freie Universität Berlin, Germany
Wenping Wang, Hong Kong University, Hong Kong 

Program Co-chairs
Kai Hormann, Università della Svizzera italiana, Lugano, Switzerland
Sara McMains, University of California, Berkeley, USA
Georg Umlauf, University of Applied Science Constance, Germany

Program Committee
Chandrajit Bajaj, University of Texas at Austin, USA
Loïc Barthe, Université Paul Sabatier, Toulouse, France
Carolina Beccari, Università di Bologna, Italy
Dominique Bechmann, Université de Strasbourg, France
Alexander Belyaev, Heriot-Watt University, United Kingdom
Mirela Ben-Chen, Technion, Haifa, Israel
George-Pierre Bonneau, GRAVIR-IMAG, France
David Bonner, Dassault Systemes, France
Wim Bronsvoort, TU Delft, Netherlands
Guido Brunnett, TU Chemnitz, Germany
Costanza Conti, Università degli Studi di Firenze, Italy
Jiansong Deng, University of Science and Technology of China, Hefei, China
Chongyang Deng, Hangzhou Dianzi University, Hangzhou, China
Tamal Dey, Ohio State University, USA
Tor Dokken, SINTEF, Norway
Gershon Elber, Technion, Israel
Shuming Gao, Zhejiang University, China
Ron Goldman, Rice University, USA
Daniel Gonsor, Boeing, USA
Thomas Grandine, Boeing, USA
Jens Gravesen, TU Denmark, Denmark
Cindy Grimm, Oregon State University, USA
Balan Gurumoorthy, Indian Institute of Science, India
Hans Hagen, University of Kaiserslautern, Germany
Stefanie Hahmann, University of Grenoble, France
Dan Halperin, Tel Aviv University, Israel
Iddo Hanniel, Technion, Israel
Dianne Hansford, Arizona State University, USA
Ying He, Nanyang Technological University, Singapore
Martin Hering-Bertram, University of Applied Science Bremen, Germany
Christoph Hoffmann, Purdue University, USA
Hugues Hoppe, Microsoft Research, USA
Shi-Min Hu, Tsinghua University, China
Qixing Huang, Stanford University, USA
Horea Ilies, University of Connecticut, USA
Ravi Janardan, University of Minnesota, USA
Robert Joan-Arinyo, Universitat Politecnica de Catalunya, Spain
Leo Joskowicz, The Hebrew University of Jerusalem, Israel
Tao Ju, Washington University at St. Louis, USA
Bert Jüttler, Johannes Kepler Universität Linz, Austria
John Keyser, Texas A&M University, USA
Myung-Soo Kim, Seoul National University, Korea
Deok-Soo Kim, Hanyang University, Korea
Young Kim, Ewha Womans University, South Korea
Leif Kobbelt, RWTH Aachen, Germany
Adarsh Krishnamurthy, University of California, San Diego, USA
Yu-Kun Lai, Cardiff University, United Kingdom
Kunwoo Lee, Seoul National University, Korea
Jyh-Ming Lien, George Mason University, USA
André Lieutier, Dassault Systèmes, France
Yaron Lipman, Weizmann Institute of Science, Rehovot, Israel
Ligang Liu, University of Science and Technology of China
Yong-Jin Liu, Tsinghua University, China
Weiyin Ma, City University of Hong Kong, Hong Kong
Stephen Mann, University of Waterloo, Canada
Carla Manni, Università di Roma “Tor Vergata”, Italy
Dinesh Manocha, University of North Carolina, USA
Ralph Martin, Cardiff University, United Kingdom
Niloy Mitra, University College London, United Kingdom
Géraldine Morin, University of Toulouse, France
Yutaka Ohtake, The University of Tokyo, Japan
Martin Peternell, Technical University of Vienna, Austria
Tom Peters, University of Connecticut, USA
Jorg Peters, University of Florida, USA
Konrad Polthier, Freie Universität Berlin, Germany
Helmut Pottmann, TU Wien, Austria
Hartmut Prautzsch, Karlsruhe University, Germany
Xiaoping Qian, Illinois Institute of Technology, USA
Ewald Quak, Tallinn University of Technology, Estonia
Karthik Ramani, Purdue University, USA
William Regli, Drexel University, USA
Ulrich Reif, Darmstadt Technical University, Germany
Richard Riesenfeld, University of Utah, USA
Lucia Romani, University of Milano-Bicocca, Italy
Jarek Rossignac, Georgia Institute of Technology, USA
Maria Lucia Sampoli, Università degli Studi di Siena, Italy
Nickolas Sapidis, University of Western Macedonia, Greece
Scott Schaefer, Texas A&M University, USA
Vadim Shapiro, University of Wisconsin, USA
Kenji Shimada, Carnegie Melon University, USA
Claudio Silva, New York University, USA
Olga Sorkine, ETH Zurich, Switzerland
Tim Strotman, Parasolid Components, Siemens PLM Software, USA
Hiromasa Suzuki, University of Tokyo, Japan
Kai Tang, Hong Kong University of Science and Technology, China
George Turkiyyah, American University of Beirut, Lebanon
Jan Vandenbrande, Boeing, USA
Tamás Várady, Budapest University of Technology and Economics, Hungary
Luiz Velho, IMPA, Brazil
Johannes Wallner, TU Graz, Austria
Wenping Wang, The University of Hong Kong, Hong Kong
Charlie Wang, Chinese University of Hong Kong, Hong Kong
Joe Warren, Rice University, USA
Ofir Weber, University of Haifa, Israel
Chee Yap, New York University, USA
Thomas Yu, Drexel University, USA
Emil Zagar, University of Ljubljana, Slovenia
Yongjie (Jessica) Zhang, Carnegie Mellon University, USA


The SIAM Special Interest Activity Group on Geometric Design and the ACM Symposium on Solid and Physical Modeling have a shared heritage dating back to the early 1980s. This biennial joint conference (started in 2009) represents a historic union of these communities, their rich academic and industrial histories, as well as the common intellectual themes that continue to move them forward. Over the past twenty years the meetings of the SIAM Special Interest Activity Group on Geometric Design have been one of the main general international conferences on geometric modeling and related areas, and have been well attended by mathematicians and engineers from academia, industry, and government. Since its inception in 1991, the ACM Symposium on Solid and Physical Modeling has been the primary international forum for disseminating research results and exchanging new ideas in relevant mathematical theory, solid modeling, physical modeling, geometric design, analysis, simulation and processing, shape computing and visualization, and various applications.

The 2013 SIAM Conference on Geometric and Physical Modeling seeks high quality, original research contributions that strive to advance all aspects of geometric and physical modeling, and their application in design, analysis and manufacturing, as well as in biomedical, geophysical, digital entertainment, and other areas (see the list of conference topics below). A shared objective of both the SIAM GD and ACM SPM communities is a desire to highlight work of the highest quality on the problems of greatest relevance to industry and science.

In ACM SPM tradition, the conference will include a track for submission of peer-reviewed technical papers for those wishing rigorous peer review and published proceedings. In addition, in the tradition of previous SIAM GD events, abstracts for minisymposia and contributed talks/posters are solicited.


Funding Agency


SIAM and the Conference Organizing Committee wish to extend their thanks and appreciation to the U.S. National Science Foundation for its support of this conference.




Important Deadlines

Due date for abstract submissions for proceedings: April 8, 2013
Due date for full paper submissions for proceedings: April 15, 2013
Due date for minisymposium proposals:  June 3, 2013 July 1, 2013 DEADLINE EXTENDED!
Due date for abstracts of all contributed and minisymposium presentations:  July 1, 2013

Application deadline for SIAM Student Travel and Post-doc/Early Career Travel Awards: July 8, 2013

October 14, 2013: Disconnect time is 4:00 PM EDT

October 14, 2013

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