This conference is sponsored by the SIAM Activity Group on Geometric Design and in cooperation with ACM SIGGRAPH incorporating the 2015 SIAM Conference on Geometric Design and the 2015 Symposium on Solid and Physical Modeling.

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Salt Lake City Restaurant Information [PDF, 70KB]

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Organizing Committee

General Co-chairs
Gershon Elber, Technion – Israel Institute of Technology, Israel
Horea Ilies, University of Connecticut, USA

Program Co-chairs
Thomas Grandine, The Boeing Company, USA
Scott Schaefer, Texas A&M University, USA
Charlie C. L. Wang, The Chinese University of Hong Kong, Hong Kong

Program Committee

Nina Amenta, University of California at Davis, USA
Carolina Beccari, Università di Bologna, Italy
Dominique Bechmann, Université de Strasbourg, France
Mirela Ben-Chen, Technion, Israel
Georges-Pierre Bonneau, Grenoble Universités, France
Willem Bronsvoort, Delft University of Technology, Netherlands
Yong Chen, University of Southern California, USA
Elaine Cohen, University of Utah, USA
Frédéric Cordier, Université de Haute-Alsace, France
Chongyang Deng, Hangzhou Dianzi University, China
Jiansong Deng, University of Science and Technology of China, China
Tamal Dey, The Ohio State University, USA
Tor Dokken, SINTEF, Norway
Gershon Elber, Technion, Israel
Shuming Gao, Zhejiang University, China
Yotam Gingold, George Mason University, USA
Dan Gonsor, Boeing, USA
Cindy Grimm, Oregon State University, USA
Xiaohu Guo, University of Texas at Dallas, USA
Balan Gurumoorthy, Indian Institute of Science, India
Stefanie Hahmann, Grenoble Institute of Technology, France
John C. Hart, University of Illinois, Urbana-Champaign , USA
Ying He, Nanyang Technological University, Singapore
Martin Hering-Bertram, Hochschule Bremen University of Applied Science, Germany
Lei Hi, Microsoft, USA
Christoph Hoffmann, Purdue University, USA
Kai Hormann, Università della Svizzera Italiana, Switzerland
Shi-Min Hu, Tsinghua University, China
Zhangjin Huang, University of Science and Technology of China, China
Horea Ilies, University of Connecticut, USA
Ravi Janardan, University of Minnesota, USA
Robert Joan-Arinyo, Universitat Politècnica de Catalunya, Spain
Leo Joskowicz, The Hebrew University of Jerusalem, Israel
Tao Ju, Washington University in St. Louis, USA
Bert Jüttler, Johannes Kepler Universität Linz, Austria
John Keyser, Texas A&M University, USA
Deok-Soo Kim, Hanyang University, Korea
Myung-Soo Kim, Seoul National University, Korea
Young Kim, Ewha Womans University, Korea
Adarsh Krishnamurthy, Iowa State University, USA
Yu-Kun Lai, Cardiff University, United Kingdom
Bruno Lévy, INRIA, France
Xin Li, Louisiana State University, USA
Jyh-Ming Lien, George Mason University, USA
Hongwei Lin, Zhejiang University, China
Yaron Lipman, Weizmann Institute of Science, Israel
Ligang Liu, University of Science and Technology of China, China
Yong-Jin Liu, Tsinghua University, China
Weiyin Ma, City University of Hong Kong, China
Stephen Mann, University of Waterloo, Canada
Dinesh Manocha, University of North Carolina at Chapel Hill, USA
Josiah Manson, Activision, USA
Ralph Martin, Cardiff University, United Kingdom
Sara McMains, University of California, Berkeley, USA
Saigopal Nelaturi, Xerox PARC, USA
Jorg Peters, University of Florida, USA
Tom Peters, University of Connecticut, USA
Konrad Polthier, Freie Universität Berlin, Germany
Xiaoping Qian, Illinois Institute of Technology, USA
Ewald Quak, Tallinn University of Technology, Estonia
Lucia Romani, University of Milano-Bicocca, Italy
Jarek Rossignac, Georgia Institute of Technology, USA
Nickolas Sapidis, University of Western Macedonia, Greece
Vadim Shapiro, University of Wisconsin-Madison, USA
Alla Sheffer, University of British Columbia, Canada
Tim Strotman, Siemens PLM Software, USA
Andrea Tagliasacchi, EPFL, Switzerland
Kai Tang, Hong Kong University of Science and Technology, China
Yiying Tong, Michigan State University, USA
Georg Umlauf, Hochschule Konstanz University of Applied Sciences, Germany
Jan Vandenbrande, Defense Advanced Research Projects Agency, USA
Johannes Wallner, Graz University of Technology, Austria
Jun Wang, Nanjing University of Aeronautics and Astronautics, China
Chee Yap, New York University, USA
Thomas Yu, Drexel University, USA
Yongjie (Jessica) Zhang, Carnegie Mellon University, USA
Jianmin Zheng, Nanyang Technological University, Singapore


The SIAM Special Interest Activity Group on Geometric Design and the Symposium on Solid and Physical Modeling have a shared heritage dating back to the early 1980s. This biennial joint conference (started in 2009) represents a historic union of these communities, their rich academic and industrial histories, as well as the common intellectual themes that continue to move them forward. Over the past twenty years the meetings of the SIAM Special Interest Activity Group on Geometric Design have been one of the main general international conferences on geometric modeling and related areas, and have been well attended by mathematicians and engineers from academia, industry, and government. Since its inception in 1991, the Symposium on Solid and Physical Modeling has been the primary international forum for disseminating research results and exchanging new ideas in relevant mathematical theory, solid modeling, physical modeling, geometric design, analysis, simulation and processing, shape computing and visualization, and various applications.

The 2015 SIAM Conference on Geometric and Physical Modeling seeks high quality, original research contributions that strive to advance all aspects of geometric and physical modeling, and their application in design, analysis and manufacturing, as well as in biomedical, geophysical, digital entertainment, and other areas (see the list of conference topics below). A shared objective of both the SIAM GD and SPM communities is a desire to highlight work of the highest quality on the problems of greatest relevance to industry and science.

In SPM tradition, the conference will include a track for submission of peer-reviewed technical papers for those wishing rigorous peer review and published proceedings. Proceedings papers should present previously unpublished, original results that are not simultaneously submitted elsewhere. All papers will be rigorously peer-reviewed by members of the international program committee and will be published as a journal special issue in Computer-Aided Design (Elsevier). The journal status of the proceedings requires a two-stage review process with conditional acceptance after the first round and final acceptance based on the revised submissions. Full and short papers undergo the same review process. In addition, in the tradition of previous SIAM/GD events, abstracts for minisymposia and contributed talks/posters are solicited. Contributed talks focused on work in progress are encouraged. To facilitate participation, limited travel awards for students and early career academics are available.

Funding Agency

SIAM and the Conference Organizing Committee wish to extend their thanks and appreciation to the U.S. National Science Foundation for its support of this conference.


3D fabrication/printing/manufacturing technologies
Anisotropic/heterogeneous/composite materials
Applied algebraic and differential geometry
Applied computational geometry and topology
Conceptual, collaborative, and distributed design
Curve, surface, and manifold modeling
Dimensioning and tolerancing
Feature modeling, recognition, and understanding
Geometric and topological representations
Geometric constraint solving and parametric modeling
Geometric interpolation and smoothing
Geometry generation and processing
Geometry compression and transmission
Isogeometric and finite element analysis
Meshing and mesh optimization
Multi-resolution modeling
Numerical analysis of geometric algorithms
Physically-based modeling and simulation
Product data exchange, standards, and interoperability
Reverse engineering/reconstruction of surfaces/solids
Robustness and validity of geometric computations
Shape modeling, synthesis, and analysis


Biomedical, biochemical, and geo-scientific applications
Computer-aided design, manufacturing, and engineering
Prototyping and manufacturing technologies
Robotics and automation
User interfaces, virtual and augmented reality
Virtual prototyping and model validation

Important Deadlines

March 20, 2015: Abstract submissions for proceedings
March 27, 2015: Full paper submissions for proceedings
May 22, 2015: First review notification for full paper submissions
June 12, 2015: Revision deadline for conditionally accepted full papers
June 26, 2015: Final notification of acceptance for conditionally accepted full papers
July 10, 2015: Camera ready copy of accepted papers deadline

May 11, 2015 June 8, 2015: Minisymposium proposals DEADLINE EXTENDED!
June 8, 2015: Abstracts of all contributed and minisymposium presentations

May 22, 2015 DEADLINE EXTENDED to June 19, 2015: SIAM Student Travel Award and Early Career Travel Award Applications

September 14, 2015 Disconnect time is 4:00 PM EDT

September 14, 2015

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